授课教师：秦舒阳

教师简介（中英文）：

10年IC封装模流分析经验，长期致力于华为，华进，华天，三星，通富，长电，日月新等数十家大型IC封测厂技术支持。

10 years of experience in IC packaging mold flow analysis, and long-term commitment to technical support from dozens of large IC packaging and testing factories such as Huawei, NCAP, Hua tian, Samsung, Tongfu, JCET, and ATX.

课程简介（中英文）：

在芯片行业日新月异的今天。对IC设计与制造产生的巨大的挑战。进而，极大的提高了仿真在设计工作的重要性。本课程将带你了解CAE的基本原理，IC封装的基本过程以及模流分析在生产制造中的重要性。并且通过上机课程，理论结合实际的更深入了解仿真过程。

In today's rapidly changing IC industry. The enormous challenges arising from IC design and manufacturing. Furthermore, it greatly enhances the importance of simulation in design work. This course will take you to understand the basic principles of CAE, the basic process of IC packaging, and the importance of moldflow analysis in production and manufacturing. And through hands-on courses, we can gain a deeper understanding of the simulation process by combining theory with practice.