授课教师：王宏跃

教师简介（中英文）：

王宏跃，工业和信息化部电子第五研究所，高级工程师，2020年于北京大学获得理学博士学位，硕士生导师。以第一（或通讯）作者发表SCI论文10篇（顶级期刊IEEE TED、EDL 、 JAP 、APEX等），申请发明专利3项，合著专著1部《集成电路封装可靠性技术》；获得广州市增城区创新团队骨干成员称号;目前兼任湖南大学、华南理工大学、西电广研院硕士校外导师，国际期刊IEEE MWCL、Microelectronics Journal等的审稿人。 在第三代半导体器件及集成系统的失效物理、退化模型、可靠性评价等方面开展了深入研究，主持（第一）了国家自然科学基金青年项目、广东省自然科学基金面上项目、科工局稳定支持项目、装发质量攻关项目、装发实验室基金等项目。

Hongyue Wang is a senior engineer at the Fifth Institute of Electronics, Ministry of Industry and Information Technology. He obtained a Ph.D. in Science from Peking University in 2020 and served as a master's supervisor. Published 10 SCI papers as the first (or corresponding) author (top journals IEEE TED, EDL, JAP, APEX, etc.), applied for 3 invention patents, and co authored 1 monograph titled "Integrated Circuit Packaging Reliability Technology"; Received the title of Key Member of the Innovation Team in Zengcheng District, Guangzhou City; At present, he also serves as a master's supervisor outside of Hunan University, South China University of Technology, and Xidian Radio and Television Research Institute, as well as a reviewer for international journals such as IEEE MWCL and Microelectronics Journal. We have conducted in-depth research on the failure physics, degradation models, and reliability evaluation of third-generation semiconductor devices and integrated systems. We have led (1) the National Natural Science Foundation Youth Program, Guangdong Provincial Natural Science Foundation General Program, Science and Industry Bureau Stability Support Program, Installation Quality Research Project, Installation Laboratory Fund, and other projects.

课程简介（中英文）：

教学内容：介绍研究热点的SiC、GaN等宽禁带半导体器件，及其在电力电子领域，射频微波领域的典型应用。介绍器件相关电学、热学特性的测试方法。

Introduce the research hotspots of wide bandgap semiconductor devices such as SiC and GaN, as well as their typical applications in the fields of power electronics, radio frequency and microwave. Introduce testing methods for electrical and thermal characteristics related to devices.

教学计划：（1）宽禁带半导体器件介绍

（2）宽禁带半导体器件应用领域

（3）宽禁带半导体器件测试方法一

（3）宽禁带半导体器件测试方法二

（4）面临问题

考核办法：报告。

预期目标：实现学生对半导体器件的基本认识，及其在实际中的应用，了解宽禁带半导体器件的基本特性和分类、测试方法。